Front-End Chemical Cleaning Equipment Enters Volume Phase, Next-Gen Track Development Progresses Smoothly

Strengthened Dominance in Photoresist Track Equipment with Rising Domestic Market Share

King Semiconductor continues to solidify its leading position in domestic photoresist coating and developing (Track) equipment. Throughout 2025, the company’s front-end Track tools secured consistent orders from leading domestic logic, memory, and power semiconductor manufacturers, with steadily improving customer recognition. Its back-end Track and single-wafer wet cleaning equipment further reinforced industry leadership, capturing repetitive batch orders from top packaging and testing clients.

As lithography technology advances toward higher throughput and precision, it imposes stricter requirements on the productivity and process capability of supporting Track systems. Currently, the company’s high-end front-end Track equipment supports inline mass production with mainstream global lithography tools for complex advanced lithography processes. To accommodate continuous capacity expansion of state-of-the-art scanners, King Semiconductor has developed a next-generation Track architecture equipped with ultra-thin film coating, ultra-fine linewidth uniformity control, and advanced defect mitigation technologies. The new platform is progressing steadily in R&D, with upcoming process verification and industrialization to accelerate market penetration. Moving forward, the company will closely iterate alongside global lithography evolution, upgrading core equipment performance and expediting domestic substitution of high-end front-end Track solutions.

Breakthrough Expansion in Chemical Cleaning Opens Second Growth Curve

King Semiconductor achieved transformative growth in its chemical cleaning business, establishing a robust second revenue growth driver. The company recorded full-year 2025 revenue of RMB 1.95 billion, representing an 11% year-over-year increase. Notably, front-end chemical cleaning equipment contributed revenue for the first time in 2025, with its revenue proportion poised to expand on the back of accelerating order acquisition and customer qualification.

Chemical cleaning and advanced packaging equipment accounted for a substantial share of the company’s 2025 order intake, with chemical cleaning solutions gaining rapid traction. The company’s strategic front-end chemical cleaning tools support versatile SPM processes and cover over 90% of mainstream front-end and back-end cleaning scenarios, including pre-deposition cleaning, post-etch cleaning, post-ion implantation cleaning, and post-CMP cleaning. Equipped with self-developed high-efficiency, low-damage jet nozzles, the equipment meets stringent cleanliness standards for advanced semiconductor nodes.

After months of continuous mass-production monitoring at customer fabs, the company’s high-end front-end chemical cleaning tools achieved performance benchmarks comparable to global industry leaders across three core metrics. Fully qualified and highly recognized by mainstream domestic clients, the equipment has secured repetitive mass orders from multiple tier-one wafer manufacturers, driving rapid order growth for the emerging cleaning product line.

Advanced Packaging Layout Enriches Product Matrix and Long-Term Growth Potential

The domestic high-precision temporary bonding equipment market has long been monopolized by overseas suppliers. Targeting booming Chiplet industrial demand, King Semiconductor has proactively developed fully automatic temporary bonding and debonding systems tailored for 2.5D/3D packaging architectures including InFO, CoWoS and HBM. The equipment is compatible with mainstream domestic and international adhesive materials, supports ultra-thick photoresist coating above 60μm, and delivers superior bonding performance with high alignment accuracy, high vacuum stability, and optimized TTV and wafer warpage control under high-temperature and high-pressure processing conditions.

A pioneer in domestic temporary bonding/debonding R&D, the company has collaborated closely with leading clients since 2021 to iterate and validate advanced packaging solutions. Its bonding and debonding equipment have reached globally advanced technological levels, obtaining steady orders and completing full-scale mass production deployment at multiple customer sites in 2025. Furthermore, the company’s newly developed frame cleaning equipment for 2.5D/3D advanced packaging has passed customer qualification and entered gradual volume shipment, further expanding its competitive product portfolio in high-growth advanced packaging segments.